首页> 外国专利> A semiconductor device and method for the deformation production in the case of silicon-based transistors by the use of implantation techniques for the production of a deformation - inducing layer under the channel region

A semiconductor device and method for the deformation production in the case of silicon-based transistors by the use of implantation techniques for the production of a deformation - inducing layer under the channel region

机译:一种用于半导体器件和方法的半导体器件和方法,用于在硅基晶体管中通过使用注入技术在沟道区下方产生形变诱导层来产生形变

摘要

By incorporating a semiconductor species having the same valence and a different covalent radius compared to the base semiconductor material on the basis of an ion implantation process, a strain-inducing material may be positioned locally within a transistor at an appropriate manufacturing stage, thereby substantially not contributing to overall process complexity and also not affecting the further processing of the semiconductor device. Hence, a high degree of flexibility may be provided with respect to enhancing transistor performance in a highly local manner.
机译:通过基于离子注入工艺并入与基础半导体材料相比具有相同化合价和不同共价半径的半导体物质,可以在适当的制造阶段将应变诱导材料局部地放置在晶体管内,从而基本上不有助于整体工艺的复杂性,并且也不会影响半导体器件的进一步处理。因此,关于以高度局部的方式增强晶体管性能,可以提供高度的灵活性。

著录项

  • 公开/公告号DE102007025336B4

    专利类型

  • 公开/公告日2010-08-19

    原文格式PDF

  • 申请/专利权人

    申请/专利号DE20071025336

  • 发明设计人

    申请日2007-05-31

  • 分类号H01L21/336;H01L21/8238;H01L29/78;H01L27/088;

  • 国家 DE

  • 入库时间 2022-08-21 18:29:02

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