TEMPERATURE ANALYZING PROGRAM, TEMPERATURE ANALYZING DEVICE, AND TEMPERATURE ANALYZING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a temperature analyzing program, a temperature analyzing device, and a temperature analyzing method that analyze temperatures of a printed board and components mounted on the printed board, in a reflow furnace while preventing analysis precision from falling accompanying reduction in computational complexity.;SOLUTION: The temperature analyzing program that makes a computer analyze the temperatures of the printed board and components in the reflow furnace includes the steps of: generating a simple model having a selected first component arranged on the printed board; setting a lattice for the simple model on the basis of the first component; acquiring a position where a second component other than the first component is mounted on the printed substrate; generating a virtual model by adding a virtual component, based on a size of a component presence lattice corresponding to the acquired position of the second component, to the component presence lattice; and analyzing the virtual model.;COPYRIGHT: (C)2011,JPO&INPIT