HIGH THERMAL CONDUCTIVITY SUBSTRATE WITH INSULATION LAYER AND MATERIAL FOR FORMING INSULATION LAYER

摘要

PROBLEM TO BE SOLVED: To provide an aluminum substrate or other high thermal conductivity substrates with an insulation layer capable of preventing occurrence of warping or cracking during temperature rise.;SOLUTION: In a metal base substrate 10 having a base layer 12 consisting of a metallic base material, an insulation layer 20 is formed on at least one surface of the base layer. The insulation layer has a porous layer 22 touching the base layer, and a compact layer 24 formed on the porous layer. The porous layer has a matrix consisting of glass and inorganic fillers, and the porosity is at least 30% at the part touching the base layer.;COPYRIGHT: (C)2012,JPO&INPIT