PHOTOSENSITIVE RESIN COMPOSITION AND REACTION DEVELOPMENT PATTERNING METHOD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a polyimide resin-containing negative photosensitive resin composition which unnecessitates the use of an organic solvent as a developer and can be developed with only an aqueous alkali solution, and to provide a reaction development patterning method using the photosensitive resin composition.;SOLUTION: The photosensitive resin composition contains: a polyimide resin; an anion regenerant; and a photoacid generator, wherein an alkali hydrolyzate of the polyimide resin is soluble in an aqueous alkali solution. The photosensitive resin composition is a negative photosensitive polyimide resin composition which can be developed with an aqueous alkali solution containing no organic solvent as a developer. By the reaction development patterning method using the photosensitive resin composition, exposed and unexposed parts of the composition after ultraviolet irradiation are made remarkably different in solubility in a developer and a negative photoresist can be formed.;COPYRIGHT: (C)2011,JPO&INPIT