EPOXY RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING THIS EPOXY RESIN COMPOSITION, ORGANICALLY MODIFIED INORGANIC FILLER, AND PROCESS FOR PRODUCING EPOXY RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in flowability, a semiconductor device using this epoxy resin composition, an organically modified inorganic filler, and a process for producing the epoxy resin composition.;SOLUTION: The epoxy resin composition includes an epoxy resin (A) and an organically modified inorganic filler (C) obtained chemically bonding an organic modifier having any one of functional groups including a carboxyl group, an amino group, and a hydroxyl group to an inorganic filler through the functional group.;COPYRIGHT: (C)2011,JPO&INPIT