Either PBTGF30 resin and PPSGF40 resin and the PA6GF30

摘要

PROBLEM TO BE SOLVED: To provide a molded electronic circuit device and a manufacturing method of the same in which the manufacturing processes are simplified while reliability is maintained.;SOLUTION: The molded electronic circuit device 100 utilizes, as a case, a synthetic resin mold component body 1 allowing insertion of a terminal 2 for connector, and accommodates a circuit board 4 joined with an aluminum base 3 into the mold component body 1. In this molded electronic circuit device 100, the bonding by an aluminum wire 7 between a bonding surface 2a of the terminal 2 and the connector 4a of the circuit board 4 is conducted in the temperature domain exceeding the temperature range of Tg+50°C by setting a glass transfer temperature of a resin material forming the mold component body 1 to Tg (°C). A cooling process is no longer required after the thermosetting bonding of the thermosetting bonding aluminum base 3 to the mold component body 1.;COPYRIGHT: (C)2007,JPO&INPIT