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Manufacturing equipment of the same complex and method for manufacturing metal-coated polyimide composite, the same complex

机译:相同复合物的制造设备和金属涂覆的聚酰亚胺复合材料的制造方法,相同复合物

摘要

In metallized polyimide composite having a copper alloy layer or copper tie coat layer formed by a dry process or electroless plating on the surface of the polyimide film and the metal seed layer was formed by electroplating thereon, and the copper or a copper alloy plating layer is metallized polyimide composite is characterized in that it comprises a copper alloy layer or copper layers 3 to 1 layer. Metal-coated polyimide composite that can be effectively suppressed (in particular, two-layer flexible laminate) peeling prevention in, from peeling off the surface of tin-plated copper layer in particular non-adhesive flexible laminate, the same and method of manufacturing the same complex It is an object of the present invention is to provide apparatus for producing a composite.
机译:在通过干法处理或化学镀而在聚酰亚胺膜的表面上形成有铜合金层或铜粘结层的金属化聚酰亚胺复合体中,通过电镀在其上形成有金属籽晶层,铜或铜合金镀层为金属化的聚酰亚胺复合材料的特征在于它包括铜合金层或3至1层的铜层。能够有效地防止(特别是两层柔性层压体)剥离(特别是非粘合性柔性层压体)的镀锡铜层表面剥落的金属涂覆的聚酰亚胺复合物及其制造方法本发明的一个目的是提供一种生产复合材料的设备。

著录项

  • 公开/公告号JPWO2009050970A1

    专利类型

  • 公开/公告日2011-03-03

    原文格式PDF

  • 申请/专利权人 日鉱金属株式会社;

    申请/专利号JP20090538010

  • 发明设计人 古曳 倫也;牧野 修仁;道下 尚則;

    申请日2008-09-16

  • 分类号C25D7/00;C25D5/56;C25D7/06;H05K1/03;H05K1/09;H05K3/00;H05K3/24;B32B15/088;

  • 国家 JP

  • 入库时间 2022-08-21 18:16:53

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