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BREAKING APPARATUS AND BREAKING METHOD FOR SUBSTRATE MADE OF BRITTLE MATERIAL

机译:脆性材料基体制造的破断装置和破断方法

摘要

In a breaking operation, a substrate is moved so that a blade can be situated in line with a scribe line, and the blade is lowered to break the substrate. After the breaking, the blade is raised. Then, the substrate is moved along its surface while taking an image of the substrate by using a camera after the breaking. Moreover, the blade is lowered to break the substrate. After the breaking, the blade is raised. Then, the substrate is moved along its surface while performing image processing concurrently. After the movement of the substrate, the position of the substrate is corrected so that the following scribe line to be cut for breaking can be situated immediately below the blade. In this way, the time required for breaking the substrate formed with a multiplicity of scribe lines into pieces can be shortened.
机译:在断裂操作中,移动基板,使得刀片可以与划线对齐,然后降低刀片以断裂基板。断裂后,将刀片抬起。然后,在断裂之后,通过使用照相机拍摄基板的图像的同时使基板沿着其表面移动。此外,降低刀片以破坏基板。断裂后,将刀片抬起。然后,基板在同时执行图像处理的同时沿着其表面移动。在基片移动之后,校正基片的位置,以便可以将紧接在刀片下面的要切割的下一条划线划在下面。以这种方式,可以缩短将由多个划线形成的基板破碎成碎片所需的时间。

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