X-RAY INSPECTION APPARATUS, X-RAY INSPECTION METHOD, X-RAY INSPECTION PROGRAM, AND X-RAY INSPECTION SYSTEM

摘要

An X-ray inspection apparatus previously acquires and stores a mask thickness in a cream solder printing as a thickness of the solder applied on the board. In a cross-section parallel to a board surface, a range in a height direction is set as an inspection target from the mask thickness of the inspection target board, and the number of cross-sections is specified. The X-ray inspection apparatus measures an area and roundness of the solder in an inspection window for each cross-section. When the minimum values of the area and roundness are not lower than reference values, the X-ray inspection apparatus determines that the soldering of the inspection window is nondefective. When one of the minimum values of the area and roundness is lower than the reference value, the X-ray inspection apparatus determines that the soldering of the inspection window is defective.