首页> 外国专利> Method of manufacturing a trench MOSFET having trench contacts integrated with trench Schottky rectifiers having planar contacts

Method of manufacturing a trench MOSFET having trench contacts integrated with trench Schottky rectifiers having planar contacts

机译:制造具有与具有平面触点的沟槽肖特基整流器集成在一起的沟槽触点的沟槽MOSFET的方法

摘要

An integrated configuration comprising trench MOSFET having trench contacts and trench Schottky rectifier having planar contacts is disclosed. The trench contacts for trench MOSFET provide a lower specific on-resistance. Besides, for trench gate connection, planar gate contact is employed in the present invention to avoid shortage issue between gate and drain in shallow trench gate. Besides, W plugs filled into both trench contacts and planar contacts enhance the metal step coverage capability.
机译:公开了包括具有沟槽接触的沟槽MOSFET和具有平面接触的沟槽肖特基整流器的集成配置。沟槽MOSFET的沟槽触点提供了较低的比导通电阻。此外,对于沟槽栅极连接,在本发明中采用平面栅极接触以避免浅沟槽栅极中栅极与漏极之间的短路问题。此外,W塞填充到沟槽触点和平面触点中,可增强金属台阶的覆盖能力。

著录项

  • 公开/公告号US8034686B2

    专利类型

  • 公开/公告日2011-10-11

    原文格式PDF

  • 申请/专利权人 FU-YUAN HSIEH;

    申请/专利号US20100838707

  • 发明设计人 FU-YUAN HSIEH;

    申请日2010-07-19

  • 分类号H01L21/336;

  • 国家 US

  • 入库时间 2022-08-21 18:14:13

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