ABSTRACT OF THE DISCLOSURESEMICONDUCTOR CUTTING DEVICE, SEMICONDUCTOR CUTTING METHOD, SEMICONDUCTOR CUTTING SYSTEM, LASER CUTTING 5DEVICE AND LASER CUTTING METHODA semiconductor cutting apparatus is disclosed which is capable of reducing an inclination of a cutting section by a laser beam of a semiconductor substrate without extending the distance from the semiconductor substrate to a laser scanning10center. The apparatus includes a laser oscillator, a transport mechanism causing a semiconductor substrate and the laser oscillator to relatively move, and a controllercontrolling the laser oscillator and the transport mechanism. When a plurality of semiconductor device regions each being surrounded by a predetermined cutting lineare provided in the semiconductor substrate, the controller controls the transport15mechanism such that a scanning center of the laser beam of the laser oscillator is located above a position inner than the predetermined cutting line of each semiconductor device region and causes the laser oscillator to perform the scanning ofthe laser beam along the predetermined cutting line of the semiconductor device region.20Fig. 1
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