PURPOSE: A solder alloy capable of the extraction of Al-Sb compound by adding Sb in Sn-Ag-Al system solder alloy and a solder junction using the same are provided to prevent the white turbidity of the solder joint by preventing the extraction of the metallic compound between Ag-Al which easily oxidized.;CONSTITUTION: A solder alloy is made from Ag 0.9~10.0 weight%, Al 0.01~0.50 weight%, Sb 0.04~3.00 weight% and the rest composed of Sn and inevitability. The ratio of Sb and Al is less than 0.25. The ratio of Sb and Al is less than 0.18. Ag is included by 1.0~8.5 mass%. Al is 0.01~0.40 mass% or 0.12~0.35 mass%. Sb is 0.50~3.00 mass% or 1.00~2.50 mass%.;COPYRIGHT KIPO 2011
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