首页> 外国专利> METHOD FOR DEPOSITING CONFORMAL AMORPHOUS CARBON FILM BY PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION (PECVD)

METHOD FOR DEPOSITING CONFORMAL AMORPHOUS CARBON FILM BY PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION (PECVD)

机译:等离子体增强化学气相沉积(PECVD)沉积共形非晶碳膜的方法

摘要

The present invention provides the method and apparatus for depositing an amorphous carbon layer on a substrate. In one embodiment, one depositing operation includes that a substrate is arranged in a processing substrate room, a Sources of Hydrocarbon Compounds by carbon to hydrogen atom ratio greater than 1: 2 is passed through the process chamber, by selected from as hydrogen, helium, argon gas, nitrogen, and combinations thereof composed by a plasma starting gas of group be passed through the process chamber, and the volume flow rate of the Sources of Hydrocarbon Compounds is 1 to the volume flow rate ratio of the plasma starting gas: two or more, a plasma is generated in the process chamber, and forms a conformal amorphous carbon layer on the substrate.
机译:本发明提供了用于在基板上沉积非晶碳层的方法和设备。在一个实施例中,一种沉积操作包括:将基板布置在处理基板室中,使碳与氢原子比大于1:2的碳氢化合物源穿过处理室,从氢,氦,使由组的等离子体起始气体组成的氩气,氮气及其组合通过处理室,并且烃化合物源的体积流量与等离子体起始气体的体积流量比为1:2或此外,等离子体在处理室中产生,并在基板上形成共形的非晶碳层。

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