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SOCKET FOR SEMICONDUCTOR PACKAGE TEST, A TEST PROBE, AND METHOD OF A SEMICONDUCTOR PACKAGE CAPABLE OF REINFORCING A HARDNESS OF A TEST PROBE END TERMINAL
SOCKET FOR SEMICONDUCTOR PACKAGE TEST, A TEST PROBE, AND METHOD OF A SEMICONDUCTOR PACKAGE CAPABLE OF REINFORCING A HARDNESS OF A TEST PROBE END TERMINAL
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机译:用于半导体封装测试的插座,一种测试探针以及一种能够增强测试探针终端的硬度的半导体封装的方法
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摘要
PURPOSE: A socket for semiconductor package test, a test probe, and a method of a semiconductor package are provided to safely maintain an initial performance without pollution due to a foreign material for a long time. ;CONSTITUTION: A socket housing(110) is stored in a semiconductor package(10). A test probe is included in lower part of the socket housing and is physically contacted with a semiconductor package. A conductive polymer resin is a part that the test probe and the semiconductor are physically contacted.;COPYRIGHT KIPO 2011
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