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PHOTOSENSITIVE RESIN COMPOSITION AND A PROTECTING FILM FOR A PRINTED CIRCUIT BOARD CAPABLE OF IMPROVING THE HEAT RESISTANCE CHARACTERISTIC AND MECHANICAL CHARACTERISTIC OF THE PROTECTING FILM BY INCLUDING A BUTADIENE MODIFIED EPOXY RESIN AS AN ESSENTIAL COMPONENT
PHOTOSENSITIVE RESIN COMPOSITION AND A PROTECTING FILM FOR A PRINTED CIRCUIT BOARD CAPABLE OF IMPROVING THE HEAT RESISTANCE CHARACTERISTIC AND MECHANICAL CHARACTERISTIC OF THE PROTECTING FILM BY INCLUDING A BUTADIENE MODIFIED EPOXY RESIN AS AN ESSENTIAL COMPONENT
PURPOSE: A photosensitive resin composition and a protecting film for a printed circuit board are provided to simultaneously satisfy heat resistance characteristic and mechanical characteristic.;CONSTITUTION: A photosensitive resin composition includes an acid modified oligomer, a photopolymerizable monomer, a photo initiator, an epoxy resin, and a butadiene modified epoxy resin. In the butadiene modified epoxy resin, an epoxy group is arranged in a main chain and at least one double bond is arranged. The butadiene modified epoxy resin is represented by chemical formula 1. In the chemical formula 1, the R1 and the R2 are respectively C1 to C5 alkyl group, C1 to C5 alkoxy group, cyclopentyl group, cyclohexyl group, C6 to C30 aryl group, C6 to C30 alkylaryl group, or a halogen element. The a to the f are respectively the integer of 0 to 5. The value of a+ b+ c + d + f is less than or equal to 20. Either the c or the e is 0. Either the d or the f is 0. The n is the integer of 1 to 50.;COPYRIGHT KIPO 2012
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机译：目的：提供一种光敏树脂组合物和一种用于印刷电路板的保护膜，以同时满足其耐热特性和机械特性。树脂和丁二烯改性的环氧树脂。在丁二烯改性的环氧树脂中，环氧基被布置在主链中并且布置了至少一个双键。丁二烯改性的环氧树脂由化学式1表示。在化学式1中，R 1和R 2分别为C 1至C 5烷基，C 1至C 5烷氧基，环戊基，环己基，C 6至C 30芳基，C 6。 C 30烷基芳基或卤素元素。 a至f分别为0到5的整数。a + b + c + d + f的值小于或等于20。c或e为0。d或f为0。 n是1到50的整数。; COPYRIGHT KIPO 2012
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