Magnetron type sputtering system with normal the target and the lateral oblique target

摘要

A magnetron type sputtering system, which is intended for the sputtering of workpieces, which have not - planar surfaces, such as, for example, concave surfaces, projections and stages of a housing for a laptop. The magnetron type sputtering system comprises a sputter chamber, comprising a carrier, a first sputter source and a second sputter source includes. The first sputter source is arranged above the carrier, in order to substantially the planar portion of the workpiece to sputter. The second sputter source is inclined at an angle, about the vertical section of the workpiece to sputter.