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The plated device, the storage body which has plated manner and the storage space which
The plated device, the storage body which has plated manner and the storage space which
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机译:电镀装置,具有电镀方式的收纳体以及收纳空间
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摘要
PROBLEM TO BE SOLVED: To provide plating equipment and a plating method which provide a plating film with high-quality and uniform film thickness, have improved plating efficiency, and achieve energy saving, and to provide a method for manufacturing a chip type electronic component.;SOLUTION: The plating equipment has: a carrier plate 22 having a storage section 24 to store an element body 10; a conveyor belt 30 which moves together with the carrier plate 22; a plating solution impregnating roller 40 which supplies a plating solution to the storage section 24 during movement of the carrier plate 22; and an anode electrode and a cathode electrode indirectly or directly connected with portions planned to be plated of the element body 10 in a state in which the plating solution is supplied to the storage section 24.;COPYRIGHT: (C)2012,JPO&INPIT
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