Non-contact apparatus for manufacturing a manufacturing method and a non-contact communication member of the communicating member, as well as a manufacturing method and a manufacturing apparatus interposer interposer

摘要

PPROBLEM TO BE SOLVED: To provide a manufacturing method for efficiently and inexpensively manufacturing a non-contact communication member. PSOLUTION: The method of manufacturing the non-contact communication member 10 is provided by which an IC chip 16 is extracted from a sheet 35 with wafer having a support sheet 37 and a wafer 36 subjected to dicing and held on the support sheet and the IC chip 16 is arranged on an antenna base material 20, thereby the non-contact communication member 10 is manufactured. The manufacturing method comprises steps of: causing a first suction nozzle 82 to suck one IC chip to peel the IC chip from the support sheet; transferring the IC chip from the first suction nozzle to a second suction nozzle 92; and arranging the IC chip held by the second suction nozzle on the antenna base material. The first suction nozzle sucks a circuit face 17a of the IC chip, and the second suction nozzle sucks a non-circuit face 17b of the IC chip. PCOPYRIGHT: (C)2008,JPO&INPIT