Adhesive composition for semiconductor device, adhesive sheet for semiconductor device using the same, substrate for connecting semiconductor device, and semiconductor device

摘要

PPROBLEM TO BE SOLVED: To provide a new adhesive composition for semiconductor devices excellent in adhesive durability, an adhesive sheet for semiconductor devices using the same, a substrate for connecting semiconductor devices and semiconductor devices. PSOLUTION: The adhesive composition for semiconductor devices comprises a 3 functional thermoplastic resin (A) having at least one functional group selected from a group consisting of epoxy, hydroxy, carboxy, amino, silanol, isocyanate, phenolic hydroxy, vinyl, maleimide and mercapto, an alicyclic epoxy resin (B) and a curing agent (C) for the epoxy resin. PCOPYRIGHT: (C)2007,JPO&INPIT