APPARATUS FOR PEELING BINDER FROM WASTE MOLDING SAND USING ULTRASONIC WAVE CAPABLE OF REDUCING RECYCLING COST OF WASTE MOLDING SAND BY ENHANCING PROCESS EFFICIENCY BY INTEGRATING MULTI PROCESSES

摘要

PURPOSE: An apparatus for peeling binder from waste molding sand using ultrasonic wave is provided to minimize the number of surface treatment by peeling interface between molding sand and binder using ultrasonic wave.;CONSTITUTION: An apparatus for peeling binder from waste molding sand using ultrasonic wave comprises a surface treatment device(40), a dewatering and drying device(31), and binder grinder(37). The surface treatment device comprises a grinding rod(26) and an ultrasonic devices(27). The waste molding sand and water are mixed by a grinding rod. The ultrasonic device injects ultrasonic wave to the mixed solution to generate bubble on interface between the waste molding sand and the binder and on the air gap of the binder. Binder stuck to the waste molding sand is cracked by impact energy generated when bubble is ruptured.;COPYRIGHT KIPO 2012