ELECTROLESS SILVER PLATING SOLUTION FOR SEMICONDUCTOR WIRING, AN ELECTROLESS PLATING METHOD USING THE SAME TO OBTAIN A DENSE SILVER COATING LAYER WITHOUT PITS OR CRACKS, AND A SILVER COATING LAYER PREPARED BY THE SAME

摘要

PURPOSE: Electroless silver plating solution for semiconductor wiring, an electroless plating method using the same, and a silver coating layer prepared by the same are provided to implement efficient and stable electroless plating at low temperatures.;CONSTITUTION: Electroless silver plating solution for semiconductor wiring comprises silver nitrate as metal salt, formalin as reductant, and ammonia solution as complexing agent. The plating solution also includes one of ethylenediamine and ethylenediaminetetraacetic acid(EDTA) as complexing agent. In the plating solution, the concentration of silver nitrate is 0.5-5 g/l and the concentration of formalin is 5-30 ml/l.;COPYRIGHT KIPO 2012