首页> 外国专利> HIGHLY THERMOCONDUCTIVE RESIN COMPOSITION HAVING HIGH THERMAL CONDUCTIVITY BY FORMING EFFECTIVE THERMOCONDUCTIVE NETWORK

HIGHLY THERMOCONDUCTIVE RESIN COMPOSITION HAVING HIGH THERMAL CONDUCTIVITY BY FORMING EFFECTIVE THERMOCONDUCTIVE NETWORK

机译:通过形成有效的导热网络,具有高导热性的高导热树脂组合物

摘要

PURPOSE: A highly thermoconductive resin composition is provided to have excellent thermal conductivity, having thermal diffusivity, bending modulus, flexibility, and strength equal or over level able to be used commercially.;CONSTITUTION: A highly thermoconductive resin composition comprises 30-70 weight% of a polyphenylene sulfide-based resin, 10-30 weight% of thermoconductive graphite, 10-40 weight% of carbon fiber, and 10-30 weight% of glass fiber. The thermoconductive graphite comprises a first thermoconductive graphite of which ratio of length to height value(L/H) is 7,000-40,000m, and a second thermoconductive graphite of which ratio of length to height value(L/H) is 10-1,000. The comprised weight ratio of the first thermoconductive graphite and the second thermoconductive graphite is 10:90-90:10.;COPYRIGHT KIPO 2012
机译:目的:提供一种高导热性树脂组合物,其具有优异的导热性,具有等于或超过商业上可使用的水平的热扩散率,弯曲模量,柔韧性和强度。;组成:一种高导热性树脂组合物,其含量为30-70重量%聚苯硫醚基树脂,10-30重量%的导热石墨,10-40重量%的碳纤维和10-30重量%的玻璃纤维。导热石墨包括第一导热石墨,其长度与高度值的比(L / H)为7,000-40,000m,以及第二导热石墨,其长度与高度值的比(L / H)为10-1,000。第一导热石墨和第二导热石墨的重量比为10:90-90:10。; COPYRIGHT KIPO 2012

著录项

  • 公开/公告号KR20120078256A

    专利类型

  • 公开/公告日2012-07-10

    原文格式PDF

  • 申请/专利权人 CHEIL INDUSTRIES INC.;

    申请/专利号KR20100140494

  • 发明设计人 LEE EUN JOO;SHIN CHAN GYUN;LIM JONG CHEOL;

    申请日2010-12-31

  • 分类号C08L81/02;C08K3/04;C08K7/06;C08K7/14;

  • 国家 KR

  • 入库时间 2022-08-21 17:09:35

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