METHOD FOR MEASURING THE HEIGHT OF A PCB BUMP THROUGH A THREE-DIMENSIONAL SHAPE MEASUREMENT DEVICE USING OPTICAL TRIANGULATION, CAPABLE OF ENHANCING THE HEIGHT MEASUREMENT ACCURACY OF BUMP BALLS OF AN IC CHIP

摘要

PURPOSE: A method for measuring the height of a PCB bump through a three-dimensional shape measurement device using optical triangulation is provided to measure the height of an un-visible portion of a pump ball of an IC chip and to make a bidirectional measurement possible at the same time.;CONSTITUTION: A method for measuring the height of a PCB bump through a three-dimensional shape measurement device using optical triangulation is as follows. A left or right laser optical system being symmetrically constituted of a computer vision system(10) being connected to a controller of an optical sensor and a semiconductor PCB inspecting device selectively or simultaneously projects laser beams to bump balls of an IC chip with lenses being respectively tilted at a predetermined angle and scans the bump balls of the IC chip while moving the IC chip with a transferring device. When the laser beam is projected to the IC chip from the left or right laser optical system, reflected lights are detected with a CCD camera(20) and an optical sensor so that the height of a bump of the IC chip is measured by using optical triangulation according to a length change of an image. When measuring with one of the left and right laser optical system, the measured height of the bump balls of the IC chip is provided. When simultaneously measuring with both left and right laser optical system, the height of each bump ball of the IC chip is calculated by calculating and averaging measured two height values of the bump ball of the IC chip.;COPYRIGHT KIPO 2012