Method for analyzing scattering parameter of measurement object e.g. semiconductor component, involves separating and demodulating tapped reference signals of incident wave and tapped returning wave of reflected wave at measuring point

摘要

The method involves transferring generator signal to input switch (2). The generator signal is forwarded as leading wave to coupling unit (3-1,3-2) selected by input switch. The reference signal of the incident wave is tapped in the coupling unit. The reflected wave from object is forwarded towards coupling unit, and returning wave relative to reflected wave is tapped at coupling unit. The tapped signals are sent to single measuring point (5), and are separated and demodulated in point. Th behavior of scattering-parameters of the object is calculated in the point. An independent claim is included for device for analyzing scattering parameter of measurement object.