ALIGNMENT MARK DEFORMATION ESTIMATION METHOD, SUBSTRATE POSITION PREDICTION METHOD, ALIGNMENT SYSTEM, AND LITHOGRAPHY DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a lithography device capable of predicting displacement of each point of a substrate more accurately.;SOLUTION: There is provided a method of estimating a value representing a level of alignment mark deformation on a substrate using an alignment system including an alignment sensor system capable of emitting light of various measurement frequency so that the light is reflected by an alignment mark and detecting a diffraction pattern formed with reflected light so as to measure the alignment position of the alignment mark on a substrate having been processed. The method includes measuring an alignment position deviation from an expected predetermined alignment position of the alignment mark for each of alignment marks related to two or more measurement frequencies by using the two or more measurement frequencies, and finding a value representing a spread of the alignment position deviation for each alignment mark so as to estimate a level of alignment mark deformation.;COPYRIGHT: (C)2013,JPO&INPIT