FAILURE ANALYSIS METHOD OF SEMICONDUCTOR DEVICE, FAILURE ANALYSIS METHOD OF CHIP-LIKE SEMICONDUCTOR DEVICE AND DYNAMIC FAILURE ANALYSIS DEVICE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a technology of executing dynamic analysis of a semiconductor device in a short time.;SOLUTION: A diameter of spot light 12 used for SDL/LADA analysis is made changeable. During irradiation of a semiconductor device of an inspection object with the spot light of a large diameter, a tester verifies an electric operation in a pertinent irradiation range. When a failure part is found during the irradiation, the spot light is switched to the spot light of a small diameter, the semiconductor device of the inspection object is irradiated, and an electric operation in a small range is verified by the tester. By repeating that, the failure part is identified.;COPYRIGHT: (C)2013,JPO&INPIT