PEELING METHOD, PROGRAM, COMPUTER STORAGE MEDIUM, PEELING DEVICE, AND PEELING SYSTEM

摘要

PROBLEM TO BE SOLVED: To prevent oxidation of a surface of a processed substrate during peeling processing between the processed substrate and a support substrate, which involves heating processing.SOLUTION: A polymerized wafer is placed at a position in a processing space between a first holding part and a second holding part, which is not in contact with the first holding part and the second holding part, by a lifting mechanism and an inactive gas is supplied into the processing space from a gas supply pipe (Process A1). Then, the second holding part is moved up by a moving mechanism and a processed wafer and a support wafer are respectively held by the first holding part and the second holding part (Process A2). Subsequently, the second holding part is moved in the horizontal direction by the moving mechanism while the processed wafer and the support wafer, respectively supported by the first holding part and the second holding part, are heated to peel the processed wafer from the support wafer (Process A3). Then, the inactive gas is supplied to the processed wafer delivered from the first holding part by a bernoulli chuck (Process A4).