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Substrate central processing unit, substrate treatment manner, application and development device, application and development manner and storage
Substrate central processing unit, substrate treatment manner, application and development device, application and development manner and storage
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机译:基板中央处理单元,基板处理方式,应用开发装置,应用开发方式和存储
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摘要
The substrate treatment apparatus includes a heating plate that heats the substrate prepared by coating a surface of the substrate with a resist and exposing the resist-coated substrate to light; a surface treatment liquid atomizing unit that atomizes a surface treatment liquid used to improve wettability of the substrate with a developer that is supplied onto the resist; a cooling unit that cools the substrate heated by the heating plate; and a surface treatment liquid supply unit that supplies the atomized surface treatment liquid onto the substrate for a portion of the period from the time when the substrate is heated until the cooling means terminates the cooling of the substrate.
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