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Double-sided heat removal of vertically integrated chip stacks using a combination of symmetric silicon carrier fluid cavities and microchannel cooling plates
Double-sided heat removal of vertically integrated chip stacks using a combination of symmetric silicon carrier fluid cavities and microchannel cooling plates
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机译:使用对称的硅载流腔和微通道冷却板的组合,对垂直集成的芯片堆叠进行双面散热
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摘要
A plurality of heat-dissipating electronic chips are arranged in a vertical chip stack. The electronic chips have electronic components thereon. A cold plate is secured to a back side of the chip stack. A silicon carrier sandwich, defining a fluid cavity, is secured to a front side of the chip stack. An inlet manifold is configured to supply cooling fluid to the cold plate and the fluid cavity of the silicon carrier sandwich. An outlet manifold is configured to receive the cooling fluid from the cold plate and the fluid cavity of the silicon carrier sandwich. The cold plate, the silicon carrier sandwich, the inlet manifold, and the outlet manifold are configured and dimensioned to electrically isolate the cooling fluid from the electronic components. A method of operating an electronic apparatus and a method of manufacturing an electronic apparatus are also disclosed. Single-sided heat removal with double-sided electrical input-output and double-sided heat removal with double-sided electrical input-output are also disclosed.
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