首页> 外国专利> WCCo the gold in order low to attach in the titanium alloy/nickel/copper/aluminum/silver low attaching alloy

WCCo the gold in order low to attach in the titanium alloy/nickel/copper/aluminum/silver low attaching alloy

机译:WCCo金以低价附着在钛合金/镍/铜/铝/银低价附着合金中

摘要

PROBLEM TO BE SOLVED: To provide gold-nickel-copper-aluminum-silver brazing filler alloy for brazing tungsten carbide-cobalt to titanium alloy.;SOLUTION: The invented brazing filler metal contains approx. 2-30% gold, approx. 4-14% nickel, approx. 25-65% copper, approx. 1-3% aluminum and approx. 20-55% silver, by weight.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供用于将碳化钨-钴钎焊成钛合金的金-镍-铜-铝-银钎焊填充合金;解决方案:本发明的钎焊填充金属包含约约2-30%的金镍约4-14%铜约25-65% 1-3%的铝和大约银,重量比20-55%.;版权:(C)2007,日本特许经营&INPIT

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