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METHOD FOR MANUFACTURING LED PACKAGE STRUTURE AND METHOD FOR MANUFACTURING LEDS USING THE LED PACKANGE STRUTURE
METHOD FOR MANUFACTURING LED PACKAGE STRUTURE AND METHOD FOR MANUFACTURING LEDS USING THE LED PACKANGE STRUTURE
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机译:制造LED封装结构的方法和使用该LED封装结构制造LED的方法
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摘要
A method for manufacturing an LED package structure is disclosed wherein a substrate with a first electrode, a second electrode and a connecting layer is provided. A photoresist coating is provided to cover the substrate, the first electrode, the second electrode and the connecting layer. A portion of the photoresist coating is removed to define a groove corresponding to the connecting layer. A metal layer is formed in the groove to join the connecting layer. A remaining portion of the photoresist coating is removed and a concave is formed and surrounded by the metal layer. A reflective layer is formed on an inside surface of the concave to join the metal layer to form a reflective cup. An LED die is mounted in the reflective cup and electrically connects with the first and second electrodes.
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