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PRECIPITATION METHOD FOR CONDUCTIVE POLYMER-METAL COMPLEX, AND CONDUCTIVE POLYMER-METAL COMPLEX
PRECIPITATION METHOD FOR CONDUCTIVE POLYMER-METAL COMPLEX, AND CONDUCTIVE POLYMER-METAL COMPLEX
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机译:导电性高分子络合物的析出方法及导电性高分子络合物
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摘要
The purpose of the present invention is to provide a method for manufacturing a conductive material suitable for, for example, filling in a through-silicon via (TSV) for three-dimensional large-scale integrated circuit (LSI) chip mounting. Irradiating a solution containing monomers to be applied a conductive polymer, and anions, Ag+, Cu2+, and other metal ions to be applied to a conductive polymer with ultraviolet light or other light with the energy necessary to excite electrons to an energy level capable of reducing the metal ions causes a conductive polymer-metal complex to precipitate. With this configuration, it is possible to precipitate a conductor with high conductivity more quickly than by conventional methods.
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