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LIFT-OFF PROCESS FOR GaN FILMS FORMED ON SiC SUBSTRATE AND DEVICES FABRICATED USING THE METHOD

机译:用该方法在SiC衬底上形成GaN薄膜的起升过程及装置

摘要

A method for fabricating a high light extraction photonic device is disclosed. A lift-off layer is grown on a substrate. An epitaxial semiconductor device structure is grown on the lift-off layer such that the lift-off layer is sandwiched between the device structure and substrate. The epitaxial semiconductor structure comprises an emitter adapted to emit light in response to a bias. The device structure, lift-off layer and substrate are flip-chip mounted on a submount such that the epitaxial semiconductor device structure is sandwiched between the submount and the lift-off layer. At least a portion of the lift-off layer is removed to separate the substrate from the device structure.
机译:公开了一种用于制造高光提取光子器件的方法。剥离层生长在基板上。在剥离层上生长外延半导体器件结构,使得剥离层被夹在器件结构和衬底之间。外延半导体结构包括适于响应于偏压而发光的发射极。器件结构,剥离层和衬底被倒装芯片安装在子基板上,使得外延半导体器件结构被夹在子基板和剥离层之间。去除剥离层的至少一部分以将衬底与器件结构分离。

著录项

  • 公开/公告号KR101203365B1

    专利类型

  • 公开/公告日2012-11-21

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20067023842

  • 发明设计人 나카무라 슈지;덴바스 스티븐;

    申请日2005-03-22

  • 分类号H01L33/02;H01L33/32;

  • 国家 KR

  • 入库时间 2022-08-21 16:28:10

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