EXPOSURE DATA PROCESSING METHOD, A RECORDING MEDIUM WHICH PROCESSES EXPOSURE DATA, AND A RECORDING MEDIA IN WHICH A PROGRAM WHICH IMPLEMENTS THE SAME IS RECORDED

摘要

PURPOSE: An exposure data processing method, a recording medium which processes exposure data, and a recording media in which a program which implements the same is recorded are provided to prevent missing hole phenomenon of solder bumps.;CONSTITUTION: An exposure data processing method comprises the following steps: obtaining measured value toward the size of the same pattern from pattern of photosensitive layer(s110); and compensating the design data by using the measured value(s120). The measured value obtaining step comprises the following steps: obtaining image data corresponding to the same pattern; and producing the size of the same pattern from the image data.;COPYRIGHT KIPO 2013;[Reference numerals] (S110) Obtaining measured value toward the size of a pattern from a pattern on a photosensitive layer formed by exposure according to design data; (S112) Obtaining image data corresponding to the pattern from a scanning device which scans the surface of the photosensitive layer; (S114) Calculating the size of the pattern from the image data; (S120) Compensating the design data using a measured value; (S122) Calculating the difference of a design value and the measured value toward the size of the pattern; (S124) Compensating the design data as much as the difference of the design value and the measured value