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POWER SEMICONDUCTOR ARRAY, A POWER SEMICONDUCTOR MODULE INCLUDING A PLURALITY OF POWER SEMICONDUCTOR ARRAYS, AND A MODULE ASSEMBLY INCLUDING A PLURALITY OF POWER SEMICONDUCTOR MODULES
POWER SEMICONDUCTOR ARRAY, A POWER SEMICONDUCTOR MODULE INCLUDING A PLURALITY OF POWER SEMICONDUCTOR ARRAYS, AND A MODULE ASSEMBLY INCLUDING A PLURALITY OF POWER SEMICONDUCTOR MODULES
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机译:功率半导体阵列,包括多个功率半导体阵列的功率半导体模块,以及包括多个功率半导体模块的模块组装
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摘要
PURPOSE: A power semiconductor array, a power semiconductor module including a plurality of power semiconductor arrays, and a module assembly including a plurality of power semiconductor modules are provided to improve heat transmission from a power semiconductor device in a circuit short fault mode.;CONSTITUTION: A base plate(2) includes a molybdenum layer(4) and a metal mounting base(6). A power semiconductor device(3) is mounted on the upper side of the base plate and is electrically and thermally coupled with the base plate. A pressing pin(7) is arranged near the power semiconductor device in an opposite side to the base plate. The metal mounting base is arranged between the semiconductor device and the molybdenum layer.;COPYRIGHT KIPO 2013
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