SUBSTRATE PROCESSING APPARATUS, A SUBSTRATE TRANSFERRING METHOD, A SEMICONDUCTOR DEVICE MANUFACTURING METHOD, A SUBSTRATE PROCESSING METHOD, AND A METHOD FOR APPLYING A DUMMY SUBSTRATE IN THE SUBSTRATE PROCESSING APPARATUS CAPABLE OF REDUCING THE EXCHANGE FREQUENCY OF THE DUMMY SUBSTRATE

摘要

PURPOSE: A substrate processing apparatus, a substrate transferring method, a semiconductor device manufacturing method, a substrate processing method, and a method for applying a dummy substrate in the substrate processing apparatus are provided to improve the use efficiency of the dummy substrate by reducing the number of the used dummy substrates.;CONSTITUTION: A plurality of processing chambers process a preset number of various substrates. A control unit(239) determines the number of dummy substrates. The control unit divides the substrate in each processing chamber and compares the thickness of a deposition layer in each processing chamber. The control unit transfers the dummy substrate to the processing chamber with the deposition layer of a thin thickness.;COPYRIGHT KIPO 2013