首页> 外国专利> METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE CAPABLE OF WIDENING A TOP INLET OF A VERTICAL CHANNEL HOLE

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE CAPABLE OF WIDENING A TOP INLET OF A VERTICAL CHANNEL HOLE

机译:制造能够覆盖垂直通道孔顶部入口的半导体器件的方法

摘要

PURPOSE: A method for manufacturing a semiconductor device is provided to reduce the difficulties of a deposition process and an etching process by supplying deposition gas and etching gas through a wide top inlet. CONSTITUTION: A mask layer is formed on a mold layer. A channel hole(103) is formed by an etching process using the mask layer. The mask layer is reduced. A spacer layer covers the reduced mask layer. A vertical channel(140) is electrically connected to a substrate.
机译:目的:提供一种用于制造半导体器件的方法,以通过宽的顶部入口供应沉积气体和蚀刻气体来减少沉积工艺和蚀刻工艺的难度。构成:在模具层上形成掩模层。使用掩模层通过蚀刻工艺形成沟道孔(103)。掩模层被减少。间隔层覆盖缩小的掩模层。垂直通道(140)电连接到基板。

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