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LOW VISCOSITY ETCHING SOLUTION FOR FORMING A METAL WIRE CAPABLE OF OBTAINING EXCELLENT PROFILE, AND CONTROLLING ETCHING RATE
LOW VISCOSITY ETCHING SOLUTION FOR FORMING A METAL WIRE CAPABLE OF OBTAINING EXCELLENT PROFILE, AND CONTROLLING ETCHING RATE
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机译:低粘度蚀刻解决方案,用于形成具有出色轮廓并控制蚀刻速率的金属线
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摘要
PURPOSE: A low viscosity etching solution is provided to control etching rate in wide range, to maintain etching uniformity, and to reduce taper angle.;CONSTITUTION: An etching solution not including hydroperoxide includes 5-40 wt% of sulfuric acid, 0.5-30 wt% of a nitric acid, 0.1-10 wt% of halogen additives, 0.5-20 wt% of an inorganic chelate agent, and residual water. The halogen additives are selected from HF, (NH4)F, (NH4)HF2, KF, NaF, MgF2, AlF3, HCl, (NH4)Cl, KCl, NaCl, MgCl2, FeCl3, AlCl3, HBr, (NH4)Br, KBr, NaBr, MgBr2, AlBr3, HI, (NH4)I, KI, NaI, MgI2, and A1I3.;COPYRIGHT KIPO 2013
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