METHOD AND A SYSTEM FOR AUTO-CALIBRATION OF INTEGRATED CIRCUIT CHIPS AT A WAFER LEVEL FOR DIRECTLY TRANSMITTING A DIRECT CURRENT TO THE INTEGRATED CIRCUIT CHIPS WHEN COMPENSATING THE PERFORMANCE OF THE IC CHIP AT THE WAFER LEVEL

摘要

PURPOSE: A method and a system for auto-calibration of integrated circuit chips at a wafer level are provided to perform correction operation more conveniently and efficiently compared to a case that inductive power is supplied to the integrated circuit chips.;CONSTITUTION: A system for auto-calibration of integrated circuit chips at a wafer level comprises a correction controller (100) and a probe pin (110). A semiconductor wafer comprises a plurality of tag chips (200), buffers (210), a signal transmission area (220), a plurality of signal lines (230), and a probe area (240). The correction controller corrects the frequency of the tag chip by bringing the probe pin into contact with the probe area to electrically connect the semiconductor wafer and the correction controller. The probe pin is connected to the correction controller positioned outside the semiconductor wafer to be in contact with the probe area of the semiconductor wafer. The buffer relays signals exchanged between the tag chip and a signal transmission area. The signal transmission area is formed in the scribe area of the semiconductor wafer and comprises the plurality of signal lines.;COPYRIGHT KIPO 2013;[Reference numerals] (100) Correction controller; (200) Tag chip; (210) Buffer