Control device in the tips

摘要

Control device (3) comprising a frame (30) which comprises an external element of the support carrying a layer of the circuit 40 and a central support element (35) supporting an assembly (50) of control points. When the controller is touching the layer of the circuit 40 of the control device (30) in the teeth from the upper face, the outer element of the supporting frame (30) is subjected to the stresses induced by this movement of descent. When the tips of the control (53) of the door - points (51) are lowered to touch the electronic components of an integrated circuit wafer to be controlled, the central support element (35) of the frame (30) is subjected to the reaction force exerted by the integrated circuit wafer.