BONDING STRENGTH EVALUATION METHOD, BONDING STRENGTH EVALUATION APPARATUS, AND SAMPLE FOR BONDING STRENGTH EVALUATION

摘要

PROBLEM TO BE SOLVED: To provide a bonding strength evaluation method, a bonding strength evaluation apparatus, and a sample for bonding strength evaluation.;SOLUTION: The bonding strength evaluation method includes: setting a micro-region including a bonded interface in a sample for evaluation; forming a first groove of a predetermined depth in a circumference of the micro-region; processing a side of the micro-region to form a second groove connected to the bonded interface; and applying pressure onto the micro-region to measure a critical point at which a delamination of the micro-region is generated.;COPYRIGHT: (C)2014,JPO&INPIT