首页> 外国专利> The organosilicic compound, the production manner, and the hardenability silicone constituent null below-mentioned general expression which includes its organosilicic compound as

The organosilicic compound, the production manner, and the hardenability silicone constituent null below-mentioned general expression which includes its organosilicic compound as

机译:作为有机硅化合物,包括有机硅化合物,有机硅化合物,有机硅化合物,有机硅化合物,有机硅化合物,有机硅化合物,有机硅化合物,有机硅化合物,有机硅化合物,有机硅化合物,有机硅化合物。

摘要

PROBLEM TO BE SOLVED: To provide an organosilicon compound useful as a raw material of an adhesiveness-imparting agent for use in a curable silicone composition, and a method of producing the same.;SOLUTION: The novel organosilicon compound is represented by formula (1) and can be produced by subjecting alkenyl functional succinic anhydride and an organosilicon compound of a specific structure to hydrosilylation. In the formula, each symbol has a specific definition. The compound represented by formula (1) is useful as an adhesiveness-imparting agent for use in a curable silicone composition. The adhesion of a curable silicone composition to aluminum or to polyphenylene sulfide can be enhanced by adding the compound represented by formula (1) into the curable silicone composition.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供一种有机硅化合物及其制备方法,该有机硅化合物用作可固化的有机硅组合物中使用的赋予粘性的试剂的原料;解决方案:该新型有机硅化合物由式(1)表示),并且可以通过使烯基官能的琥珀酸酐和特定结构的有机硅化合物进行氢化硅烷化来制备。在公式中,每个符号都有特定的定义。由式(1)表示的化合物可用作在可固化的有机硅组合物中使用的赋予粘性的试剂。通过将式(1)表示的化合物加入可固化的有机硅组合物中,可增强可固化的有机硅组合物对铝或对聚苯硫醚的粘附力。;版权所有:(C)2011,JPO&INPIT

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