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Thermal analysis model generation apparatus, thermal analysis model generation program, thermal analysis model generation method, and thermal analysis apparatus
Thermal analysis model generation apparatus, thermal analysis model generation program, thermal analysis model generation method, and thermal analysis apparatus
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机译:热分析模型生成装置,热分析模型生成程序,热分析模型生成方法以及热分析装置
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摘要
A thermal analysis apparatus calculates an area of a predetermined range including an electronic component mounted on a printed-circuit board. The thermal analysis apparatus counts the number of via holes included in the predetermined range of which the area is calculated. The thermal analysis apparatus calculates a first physical property value using the area calculated, the number of via holes counted, and a preset physical property value of a conductor. The thermal analysis apparatus generates a thermal analysis model subject to thermal analysis in which a preset physical property value is set in the electronic component and a heat release path having the first physical property value calculated is provided in the printed-circuit board so as to extend from the electronic component in a layer direction of the printed-circuit board.
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