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Method for forming amorphous carbon nitride film, amorphous carbon nitride film, multilayer resist film, method for manufacturing semiconductor device, and storage medium in which control program is stored

机译:非晶碳氮化物膜的形成方法,非晶碳氮化物膜,多层抗蚀剂膜,半导体装置的制造方法以及存储控制程序的存储介质

摘要

An amorphous carbon film, which has excellent etching resistance and is capable of reducing reflectance when a resist film is exposed to light, is form. A method for manufacturing a semiconductor device includes forming an object film to be etched on a wafer, supplying a process gas containing a CO gas and an N2 gas into a processing container, forming an amorphous carbon nitride film from the supplied CO gas and N2 gas, forming a silicon oxide film on the amorphous carbon nitride film, forming an ArF resist film on the silicon oxide film, patterning the ArF resist film, etching the silicon oxide film by using the ArF resist film as a mask, etching the amorphous carbon nitride film by using the silicon oxide film as a mask, and etching the object film to be etched by using the amorphous carbon nitride film as a mask.
机译:形成具有优异的耐蚀刻性并且当抗蚀剂膜曝光时能够降低反射率的非晶碳膜。一种用于制造半导体器件的方法,包括:在晶片上形成待蚀刻的目标膜;将包含CO气体和N 2 气体的处理气体供应到处理容器中;形成非晶氮化碳膜。从供给的CO气体和N 2 气体中,在非晶氮化碳膜上形成氧化硅膜,在氧化硅膜上形成ArF抗蚀剂膜,对ArF抗蚀剂膜进行构图,蚀刻氧化硅使用ArF抗蚀剂膜作为掩模,通过使用氧化硅膜作为掩模来蚀刻非晶氮化碳膜,并且使用非晶氮化碳膜作为掩模来蚀刻待蚀刻的目标膜。

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