首页> 外国专利> MULTICHIP LED PACKAGE WITH IN-PACKAGE QUANTITATIVE AND SPECTRAL SENSING CAPABILITY AND DIGITAL SIGNAL OUTPUT

MULTICHIP LED PACKAGE WITH IN-PACKAGE QUANTITATIVE AND SPECTRAL SENSING CAPABILITY AND DIGITAL SIGNAL OUTPUT

机译:具有片内量化和频谱感应能力以及数字信号输出的多芯片LED封装

摘要

A multichip light-emitting-diode package having a support member, at least two light-emitting-diode chips disposed on the support member, at least one sensor disposed on the support member for reporting quantitative and spectral information to a controller, relating to the light output of the light-emitting-diodes, and a signal processing circuit, including an analog-to-digital converter logic circuit, disposed on the support member for converting the analog signal output produced by the sensors to a digital signal output.
机译:一种多芯片发光二极管封装,其具有支撑构件,至少两个布置在支撑构件上的发光二极管芯片,至少一个传感器布置在支撑构件上,用于向控制器报告定量和光谱信息,该传感器涉及发光二极管的光输出,以及包括模数转换器逻辑电路的信号处理电路,其布置在支撑构件上,用于将传感器产生的模拟信号输出转换为数字信号输出。

著录项

  • 公开/公告号EP1415345B1

    专利类型

  • 公开/公告日2014-04-23

    原文格式PDF

  • 申请/专利权人 KONINKLIJKE PHILIPS N.V.;

    申请/专利号EP20020755430

  • 发明设计人 BRUNING GERT W.;

    申请日2002-07-23

  • 分类号H01L25/075;H01L25/16;H05B33/08;

  • 国家 EP

  • 入库时间 2022-08-21 15:51:56

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