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ALKALI METAL PATTERNING METHOD USING BASIC PASTE, COPPER PATTERNING METHOD DUE TO THE SUBSTITUTION OF ALKALI METAL AND TRANSPARENT FILM WRAPPED IN COPPER WIRE MANUFACTURING METHOD
ALKALI METAL PATTERNING METHOD USING BASIC PASTE, COPPER PATTERNING METHOD DUE TO THE SUBSTITUTION OF ALKALI METAL AND TRANSPARENT FILM WRAPPED IN COPPER WIRE MANUFACTURING METHOD
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机译:使用碱性糊剂进行碱金属划刻的方法,由于用碱金属金属代替铜丝制造的透明膜而形成的铜划定方法
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摘要
The present invention relates to a metal wiring technique for enabling a large-sized process and reducing process costs compared to an existing technique by using basic paste. The present invention is to provide an alkali metal patterning method using basic paste that includes a step (a) of manufacturing basic paste by mixing a thickener with a basic solution including alkali metal; and a step (b) of adsorbing the alkali metal to a substrate by patterning the basic paste to the substrate made of a basic reaction resin.
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