首页> 外国专利> ELECTROLESS COBALT PLATING SOLUTION, ELECTROLESS COBALT PLATING METHOD USING SAME, AND COBALT PLATING LAYER MANUFACTURED BY USING SAME

ELECTROLESS COBALT PLATING SOLUTION, ELECTROLESS COBALT PLATING METHOD USING SAME, AND COBALT PLATING LAYER MANUFACTURED BY USING SAME

机译:化学镀钴溶液,使用相同的化学镀钴方法,以及使用相同的方法制造的钴镀层

摘要

The present invention provides an electroless cobalt plating solution which provides excellent thermal properties, enhanced flexibility, and enhanced welding properties. According to an embodiment of the present invention, the electroless cobalt plating solution includes a cobalt metal salt which provides cobalt ions for plating; a reducing agent which reduces cobalt ions for plating; a complexing agent which forms a complex with the cobalt ions for plating and includes at least one of carboxylic acid and alpha-hydroxy acid; and a stabilizing agent which stabilizes the cobalt ions for plating and includes ammonium sulfate.;COPYRIGHT KIPO 2014
机译:本发明提供了化学镀钴溶液,其提供了优异的热性能,增强的柔韧性和增强的焊接性能。根据本发明的一个实施方案,所述化学镀钴溶液包括提供用于镀覆的钴离子的钴金属盐;和还原剂,其还原用于电镀的钴离子;与镀敷用钴离子形成络合物的络合剂,其包含羧酸和α-羟基酸中的至少一种。 COPYRIGHT KIPO 2014;以及一种稳定镀层中钴离子的稳定剂,其中包括硫酸铵。

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