首页> 外国专利> SAMPLING APPARATUS FOR SEDIMENT SAMPLE CAPABLE OF MEASURING ENVIRONMENT CONDITIONS OF SAMPLING SITE AND METHOD FOR ANALYZING SEDIMENT SAMPLE USING SAME

SAMPLING APPARATUS FOR SEDIMENT SAMPLE CAPABLE OF MEASURING ENVIRONMENT CONDITIONS OF SAMPLING SITE AND METHOD FOR ANALYZING SEDIMENT SAMPLE USING SAME

机译:能够测量采样点环境条件的沉积物采样装置及使用相同方法分析沉积物样品的方法

摘要

The present invention relates to a sampling apparatus for sediment samples that samples sediment samples depth by depth with respect to an ocean sediment layer for a geological survey of the sediment layer. According to the present invention, provided is a sampling apparatus for sediment samples capable of measuring the environment conditions of a sampling site that is configured so that information with respect to the environment conditions of the sampling site such as the temperature and pressure at a sampling position can be measured with respect to each of the sediment samples during the depth-specific sampling of the sediment samples with respect to the sediment layer for the geological survey of the ocean sediment layer. In addition, the sediment samples are acquired at each depth along with the information on the environment conditions such as the temperature and pressure at the position, and then analysis is performed during an analysis operation for the samples such as ultrasonic pulse velocity measurement by using the information on the environment conditions at the sampling site with respect to each of the sediment samples. Accordingly, the post-correction of the related art that is performed after a laboratory condition analysis does not have to be performed, and the analysis can be performed with greater accuracy.;COPYRIGHT KIPO 2014
机译:沉积物采样装置技术领域本发明涉及一种用于沉积物采样的采样装置,其相对于海洋沉积物层按深度对沉积物样本进行深度采样,以用于沉积物层的地质调查。根据本发明,提供了一种用于沉积物样品的采样设备,其能够测量采样位置的环境条件,该采样设备被配置为使得关于采样位置的环境条件的信息,诸如采样位置处的温度和压力。在对海洋沉积物层进行地质调查的沉积物样品相对于沉积物层的深度特定采样期间,可以对每个沉积物样品进行测量。另外,在每个深度处获取沉积物样本以及有关环境条件的信息(例如该位置的温度和压力),然后在分析操作期间对样本进行分析,例如使用超声波脉冲速度测量。有关每个沉积物样本的采样地点环境条件的信息。因此,不必进行实验室条件分析之后进行的相关技术的后校正,并且可以以更高的精度进行分析。; COPYRIGHT KIPO 2014

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号