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METHOD FOR FORMING A memristor BASED ALLOY SOLID Si: Me and structure memristor BASED ALLOY SOLID Si: Me

机译:形成基于忆阻器的合金固体Si:Me的方法和基于忆阻器的合金固体Si:Me的结构

摘要

FIELD: physics.;SUBSTANCE: invention relates to microelectronics and specifically to a technique of producing an integrated logic element and/or nonvolatile memory based on metal-insulator-metal (MIM) structures. Since this step is critical for obtaining the necessary characteristics of MIM structures, the absence of said step enables to obtain large arrays of MIM structures with uniform parameters. The method of forming a memristor based on MIM structures includes forming an insulator layer from a solid-state alloy Si:Me, which is formed with a predetermined concentration profile of the metal Me on the thickness. To this end, the insulator is grown by successively depositing ultra-thin layers of Si and Me of different thickness to enable growth of concentration of Me and Si in the direction from the lower electrode to the upper electrode in the range of 1-25%. A memristor based on MIM structures is also formed.;EFFECT: obtaining a memristor which is characterised by absence of "moulding" during initial transition of the structure to a low-resistance state.;18 cl, 2 dwg, 1 ex
机译:技术领域本发明涉及微电子学,尤其涉及一种基于金属-绝缘体-金属(MIM)结构的集成逻辑元件和/或非易失性存储器的生产技术。由于该步骤对于获得MIM结构的必要特性至关重要,因此,无需所述步骤就可以获得具有统一参数的MIM结构的大型阵列。基于MIM结构形成忆阻器的方法包括由固态合金Si:Me形成绝缘体层,所述固态合金Si:Me在厚度上形成有预定的金属Me浓度分布。为此,通过依次沉积不同厚度的Si和Me的超薄层来生长绝缘体,以使Me和Si的浓度在从下部电极到上部电极的方向上的生长在1-25%的范围内。 。还形成了基于MIM结构的忆阻器;效果:获得一种忆阻器,其特征是在结构初始过渡到低电阻状态时不存在“模制”。; 18 cl,2 dwg,1 ex

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