TAB LEAD SEALING ADHESIVE FILM COMPRISING MODIFIED POLYOLEFIN-BASED RESIN WITH THERMAL ADHESIVENESS

摘要

PROBLEM TO BE SOLVED: To provide a tab lead sealing adhesive film comprising a modified polyolefin-based resin with thermal adhesiveness.SOLUTION: There is provided a tab lead sealing adhesive film comprising a modified polyolefin-based resin which comprises: 50 to 98 wt.% of a modified polyolefin resin (A) which is graft-modified using a monomer component including an ethylenic double bond and an epoxy group in a same molecule; and 2 to 50 wt.% of a polyolefin-based resin (B), where the melting point (Tm(A)) derived from the modified polyolefin-based resin (A) is 120°C or more and 150°C or less, the melting point (Tm(B)) of the polyolefin-based resin (B) is 80°C or more and 120°C or less, and the heat of melting H(B) derived from the polyolefin-based resin (B) is larger than the heat of melting H(A) derived from the modified polyolefin-based resin (A).